礦ision Build Log
Tool Versions:
IDE-Version: μVision V5.32.0.0 Copyright (C) 2020 ARM Ltd and ARM Germany GmbH. All rights reserved. License Information: 1 1, 11, LIC=9WSKC-7L4Q8-EVG1R-KTZPQ-1PV1H-SGZ8P Tool Versions: Toolchain: MDK-ARM Plus Version: 5.32.0.0 Toolchain Path: D:\USERSOFT\keil532\ARM\ARMCC\Bin C Compiler: Armcc.exe V5.06 update 7 (build 960) Assembler: Armasm.exe V5.06 update 7 (build 960) Linker/Locator: ArmLink.exe V5.06 update 7 (build 960) Library Manager: ArmAr.exe V5.06 update 7 (build 960) Hex Converter: FromElf.exe V5.06 update 7 (build 960) CPU DLL: SARMCM3.DLL V5.32.0.0 Dialog DLL: DARMCM1.DLL V1.19.4.0 Target DLL: Segger\JL2CM3.dll V2.99.38.0 Dialog DLL: TARMCM1.DLL V1.14.3.0Project:
D:\程序总结\YS32MD210\MDK-ARM\YS32MD210K6U7_Project1.uvprojx Project File Date: 10/18/2025Output:
*** Using Compiler 'V5.06 update 7 (build 960)', folder: 'D:\USERSOFT\keil532\ARM\ARMCC\Bin' Build target 'YS32MD210K6U7_Project1' After Build - User command #1: fromelf --bin -o "D:\程序总结\YS32MD210\MDK-ARM\Objects\YS32MD210_BLDC_LIB1018.bin" "D:\程序总结\YS32MD210\MDK-ARM\Objects\YS32MD210_BLDC_LIB1018.axf" ".\Objects\YS32MD210_BLDC_LIB1018.axf" - 0 Error(s), 0 Warning(s).Software Packages used:
Package Vendor: YSPRING YSPRING.YS32MD210.0.0.24 YSPRING YS32MD210 Series Device Support, Drivers and ExamplesCollection of Component include folders:
D:\USERSOFT\keil532\YSPRING\YS32MD210\0.0.24\Device\IncludeCollection of Component Files used:
Build Time Elapsed: 00:00:00